DEN Networks Limited - Technical Role - Product Life Cycle Management

Preference will be given to Male candidates and who belong to Delhi/NCR area.

Job Description :

Job Purpose :

- Product planning, evaluation, development, overall project Management and Quality control of New and existing models of Set Top Boxes and features.

Competencies, Knowledge and Experience :

Education Qualification :

- M.B.A (operations & Marketing)

- B.Tech (Electronics & Communication)

Relevant Experience : 8-10 Years

Competencies (Primary and Secondary) :

1. CPE Product planning, Development, testing and life cycle management of new & legacy STBs.

2. Ability to lead a team and good communication and inter personnel skills.

Principal Accountabilities and Key Deliverables :

Expected End Result Major Activities :

Operations :

1. Technical support and management of more than 8 million STBs with 11 models already deployed in the field.

2. Support to field staff on escalated STB issues.

3. Weekly calls and day to day interaction with all India Operations & Logistics team to improve the overall repair process.

4. Periodic repair MIS generation for top management and Regional Ops team.

Quality :

1. SW bug management with NDS, Cisco & field

2. Software and hardware testing for new and legacy STBs.

3. Technical support to repair centres & QC of repair processes.

4. Periodic inspection / audit of repair vendor sites.

5. Interaction with STB vendors for corrective HW changes to reduce failure rate.

CSAT (Customer Satisfaction) :

1. Periodic training to Customer care agents / RCSEs / field engineers.

2. Periodic Interaction with DEN Customer service team for new updates and features w.r.t STBs.

Complaint Management :

1. Attending to escalated issues from the field.

Project Management :

1. Gathering requirements from Business development or management for new STBs, features and applications.

2. Releasing and evaluation of RFP for new STBs.

3. End to end project management from Kick-off to field trial and mass production.

4. Continuous interaction with OEMs, silicon and other vendors for new developments and updates.

5. Tracking of Silicon chip set roadmap for different vendors.

Dimensions :

1) Timely delivery of new projects

2) Pre-emptive finding of new bugs and issues in testlab.

3) Proper resolution of field issues.

Challenges :

1. Going in for new features in term of hardware and software while keeping Cost benefit analysis in mind.

2. Maintaining a balance between internal stakeholders (Management and business operations) and external stakeholders (OEMs, chip vendors and repair partners).

3. Team motivation at all times.

Offered Salary - Up to 16 Lac PA